Trelic (Oy, Ltd) is a start-up company providing consultation and experimental work on electronics materials, packaging technologies and reliability testing.
Trelic is based on the research the founders have conducted in Tampere University of Technology in the Packaging and Reliability Research Group in numerous industrial projects. We offer services in electronics packaging, materials characterisation and reliability analysis including planning of reliability testing, failure analysis and accelerated life testing.
We can help you to adapt new manufacturing and miniaturization technologies and materials and verify their usability and reliability. We also offer small scale production for challenging technologies. Moreover, we can help you with reliability analysis of your product using various test methods, development of tailored reliability testing methods and in-depth failure analysis.
Laura Frisk, Ph.D. (2007, materials science). Laura has been involved in the reliability research group at Tampere University of Technology (TUT) almost from its start. From 2009 onwards she took on the financial and strategic responsibility of the group. Laura has worked in a wide range of topics in electronics packaging, materials and reliability. Her specialties are polymer materials and their use, interconnections, substrates, printed circuit boards (PCBs) and failure analysis.
Janne Kiilunen, Ph.D. (2014, electronics). Janne joined the reliability research group in 2004. Since then he has worked in a number of projects relating electronics reliability and accelerated environmental testing. Janne has also been involved with project management. His specialties include accelerated reliability testing, development of testing and measurement methods, and failure analysis.
Sanna Lahokallio, Ph.D. (2017, electronics). Sanna joined the reliability research group in 2009. Her main areas have been RFID and electrically conductive adhesives and their use at challenging environments. Sanna’s specialties include also material analysis, interconnection technologies, printed circuit boards (PCB), adhesives and failure analysis.
Juha Pippola, M.Sc. (2010, electronics). Juha started working in the reliability research group in 2010. His main topic has been testing of industrial and power electronics devices using multi stress accelerated test methods. Additionally, Juha has been working in projects with an aim to develop better corrosion testing methods and to analyze the effect of coatings on corrosion. His specialties include accelerated reliability testing at product level, mechanical testing, dust and corrosion testing and failure analysis.
Brief history of our background
Trelic and our expertise originates from years of research, more spesifically from Packaging and Reliability Research Group, which was established in the Institute of Electronics, Tampere University of Technology in 1998. During the years 1998-2016 the research group worked in a vast variety of industrial and academic projects. The research group always conducted a very close collaboration with many industrial companies.
The projects of the group dealt for example with miniaturization, flip chip and flex on board technologies, RFID packaging technologies, and industrial electronics packaging. Most of of the projects have included lots of material characterization and materials selections. For example, various interconnection materials such as lead free solders and electrically conductive adhesives as well as protective materials such as coatings, glob tops and over molds were widely studied in the group. The majority of the research projects dealt with reliability issues and several projects concentrated on reliability testing for example related to tailored accelerated life testing. In several projects the group developed new testing methods to assess reliability of a product. The projects were funded mostly by TEKES, but the group had also projects funded by the Academy of Finland and EU. The research foundings of the group were published in numerous scientific articles and has been presented in the leading conferences.