Adhesive interconnections

Electrically conductive adhesives

One type of adhesives is very close to our hearts: Electrically conductive adhesives, ECAs, ACAs, ACPs, ACFs, ICAs, ICPs, epoxy glues, silver glues – however you want to call them.

Electrically and thermally conductive adhesives are very useful and versatile materials. They can perform very reliably even in harsh environments, but for this a right material must be chosen and the attachment process must be optimized.

Various kinds of electrically conductive adhesives are commercially available. However, depending on their composition, intended use and their sensitivity to bonding parameters, they are not as straightforward to use as solders.

When selecting an adhesive material, several things affect the requirements for suitable adhesive. These include for example materials (component, substrate, conductive traces), particle in the adhesive (material, size, concentration) and use environment for the final product.

Attachment methods for ECAs

Flex and stretch attachments

We can attach various flex and stretch structures including flex-on-board, flex-to-flex, stretch-on-board and stretch-on-flex.

Flip chip

We can attach flip chip attachments both on rigid substrates (chip-on-board, chip-on-glass) and flexible substrates (chip-on-flex). We have years of experience in small pitch as well as large area and high I/O flip chip attachments on different substrate types. We can for example attach demanding sensor components.

Pick and place

We offer attachments of surface mount components for prototyping and test structures even with small components.

Optimization of bonding processes

Adhesives are very useful and versatile materials. They can perform very reliably even in harsh environments, but for this a right material must be selected and the attachment process must be optimized.

We can optimize your process parameter for example with principles of design of experiments (DOE)!

Reliability of adhesive interconnections

Products can be exposed to various environmental stresses during assembly, shipment, storage and operation, which may cause failures. Furthermore, materials age which may cause deterioration of material properties and cause malfunction.

One of our main expertise areas is understanding demanding environments, what kind of stresses are present and how to consider them regarding your product.