Welcome to our blog!

We will share here stories and comments about electronics, materials and reliability. Click the links below to read the posts.

IP testing – what should you know about it?

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Thermal cycling vs. Thermal shock

Infographic about the differences of these two testing methods

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10 reasons why humidity testing is so useful

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Infographic about hydrolysis

Why some plastics crack in humid environment?

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Overstress vs wear

Infograph about the differences of these two failure causes

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Why is it important to know the curing degree?

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Epoxy adhesive may not be the best choice for flexible structures

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Failure analysis – the crucial tool when something goes wrong

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Electrically conductive adhesives – ACAs versus ICAs

Infograph about the two types of adhesives

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How should flexible and stretchable structures be tested for reliability?

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Why should reliability be considered as early as possible in product development?

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Reliability testing versus validation testing

Infograph about the two testing types

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What should you know about thermal limits when selecting a plastic material for your product?

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Severe corrosion of a PCB in salt spray testing

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The quality of the surface finish in a microvia structure

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The quality of the surface finish on top of the copper traces

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Attaching flexible circuits to each other

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Polyimide in flexible PCBs – why is PI such a popular material?

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Environmental stress cracking (ESC)

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Why 85/85 test is a wrong test choice for polyethylene terephthalate (PET)?

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Salt corrosion on printed circuit board (PCB)

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Why does it matter whether you drop your phone to a swimming pool, to a lake, to a sea or to the loo?

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Failure analysis

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Wire bond test structure

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Seasonal greetings 2017

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Test structure design, measurement wires for real-time measurement

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Suomi100

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Void in a microvia layer of a printed circuit board (PCB)

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Is Trelic #VaihtoehtoEskolle?

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Contaminated surface of a printed circuit board (PCB)

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Corrosion testing with dust test

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Conductive particle in anisotropically (electrically) conductive adhesive

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Real-time measurements in reliability testing

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Corrosion testing with mixed flowing gas (MFG) test

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Summer 2017

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Oxidative induction time/temperature (OIT) with differential scanning calorimetry (DSC)

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Differential scanning calorimetry (DSC)

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Barrel crack on plated through hole (PTH) structure

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Printed circuit board (PCB) plated through hole (PTH) structure

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Thermomechanical analyzer (TMA)

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Glop top material

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