Welcome to our blog!

We will share here stories and comments about electronics, materials and reliability. Click the links below to read the posts.

How to conduct failure analysis

—-

Soldering in electronics

Infographic about soldering process and the important factors for ensuring good-quality interconnections.

—-

Unstable resistance – why flexible electronics should be monitored in real-time during testing

—-

Eight steps to reliability testing

Infographic about steps to choose suitable test method

—-

IP testing – what should you know about it?

—-

Thermal cycling vs. Thermal shock

Infographic about the differences of these two testing methods

—-

10 reasons why humidity testing is so useful

—-

Infographic about hydrolysis

Why some plastics crack in humid environment?

—-

Overstress vs wear

Infograph about the differences of these two failure causes

—–

Why is it important to know the curing degree?

—–

Epoxy adhesive may not be the best choice for flexible structures

—–

Failure analysis – the crucial tool when something goes wrong

——-

Electrically conductive adhesives – ACAs versus ICAs

Infograph about the two types of adhesives

——-

How should flexible and stretchable structures be tested for reliability?

——-

Why should reliability be considered as early as possible in product development?

——-

Reliability testing versus validation testing

Infograph about the two testing types

——-

What should you know about thermal limits when selecting a plastic material for your product?

——-

Severe corrosion of a PCB in salt spray testing

——-

The quality of the surface finish in a microvia structure

——-

The quality of the surface finish on top of the copper traces

——-

Attaching flexible circuits to each other

——-

Polyimide in flexible PCBs – why is PI such a popular material?

——-

Environmental stress cracking (ESC)

——-

Why 85/85 test is a wrong test choice for polyethylene terephthalate (PET)?

——-

Salt corrosion on printed circuit board (PCB)

——-

Why does it matter whether you drop your phone to a swimming pool, to a lake, to a sea or to the loo?

——-

Failure analysis

——-

Wire bond test structure

——-

Seasonal greetings 2017

——-

Test structure design, measurement wires for real-time measurement

——-

Suomi100

——-

Void in a microvia layer of a printed circuit board (PCB)

——-

Is Trelic #VaihtoehtoEskolle?

——-

Contaminated surface of a printed circuit board (PCB)

——-

Corrosion testing with dust test

——-

Conductive particle in anisotropically (electrically) conductive adhesive

——-

Real-time measurements in reliability testing

——-

Corrosion testing with mixed flowing gas (MFG) test

——-

Summer 2017

——-

Oxidative induction time/temperature (OIT) with differential scanning calorimetry (DSC)

——-

Differential scanning calorimetry (DSC)

——-

Barrel crack on plated through hole (PTH) structure

——-

Printed circuit board (PCB) plated through hole (PTH) structure

——-

Thermomechanical analyzer (TMA)

——-

Glop top material

——–