Trelic in Semicon Europa in mid November!

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Trelic in Semicon Europa in mid November!

Category : News

Laura and Sanna will be in Semicon Europa, Munich in November 14-16. Let’s meet and greet in Munich! If you want to talk about collaboration regarding packaging, reliability or materials, please contact us at info@trelic.fi!

Laura will also held two interesting presentations on Wednesday 15th. In Advanced Packaging Conference her topic is “Corrosion behaviour of Printed Circuit Board Surface Finishes in Mixed Flowing Gas Testing” and in 2017FLEX Europe-Be Flexible Conference she will talk about “Electrically conductive adhesive attachments in flexible packaging”.